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翻訳と辞書　辞書検索 [ 開発暫定版 ] スポンサード リンク Organic Solderability Preservative ： ウィキペディア英語版 Organic solderability preservative Organic Solderability Preservative, or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering. The compounds typically used are from the azole family such as benzotriazoles, imidazoles, benzimidazoles. These adsorb on copper surfaces, by forming coordination bonds with copper atoms and form thicker films through formation of copper (I) – N–heterocycle complexes. The typical film thickness used is in the tens to hundreds of nanometers. == References == * Tong, K. H., M. T. Ku, K. L. Hsu, Q. Tang, C. Y. Chan, and K. W. Yee. “The Evolution of Organic Solderability Preservative (OSP) Process in PCB Application.” 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). Institute of Electrical & Electronics Engineers (IEEE), October 2013. doi:10.1109/impact.2013.6706620. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Organic solderability preservative」の詳細全文を読む スポンサード リンク 翻訳と辞書 : 翻訳のためのインターネットリソース Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.